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Thermally Conductive S-Putty
Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and solve drying problems to increase the thermal conductivity. S-Putty is a great alternative to thermal grease in design gaps under 1.0mm (0.2mm~0.5mm). We highly recommend pairing it with the S-Putty Dispensing Robot.
Features
Thermal conductivity: 2.0/3.5/6.0 W/m*K
Tolerance filled
High compressibility with low stress
No vertical flow
High reliability
Bond Line Thickness: 100-1500μm
Applications
Notebook computers
Heat pipe assemblies
TV hardware
Wireless communication hardware
High-speed mass storage drives
Set-top box
IP CAM
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