Speed Measurement Equipment PCB Fab, Sourcing, Assembly - Onestop PCB Assembly Service‎

Product Details

Product Details

Supplier: Shenzhen Big Electronic Layer Statistics: 8 Application Areas: Measuring Equipment Manufacturer, Procurement, Assembly Circuit Board Assembly Services

PCB parameters: DB2/HP-150 Thickness: 5.5mm Surface treatment (such as testing: 100% electronic testing Packaging: vacuum packaging Delivery time: 10-15 days)

PCB production capacity

Number of layers: 1-30 layers

Quantity: 25,000 square meters per month

PC type: 5OZ immersed copper, impedance board, HDI, high frequency board, aluminum, FPC, soft and hard board circuit board

Basic material brand

High frequency: Rogers, Tacony

HTG: S1000-2M, Lianmao IT180A

Welding mask: Taiyue PSR-2000/4000 series

Surface treatment: HASL, IMU, OSP, IM tin, IM silver, 50-inch hybrid hard plating

Surface treatment: I use gold fingers + OSP I use gold fingers I use silver fingers + gold fingers

Polychlorinated biphenyls technical parameters

Minimum trace width/spacing: 2.5/2.5mil external, 3/3mil internal (1/3, 1/2oz)

Minimum pass: 0.5mm/0.1mm (laser)

Lowest loop: 4 miles

Maximum copper thickness: 7 ounces

Maximum size:650x1100mm

Thickness to aperture ratio: 20:1

tolerate

PTH only: +/-0.0075mm (Simple: +/-0.05mm)

: +/-0.1mm (simple: +/-0.05-0.075mm).

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Supplier: Shenzhen Big Electronic Layer Statistics: 8 Application Areas: Measuring Equipment Manufacturer, Procurement, Assembly Circuit Board Assembly Services

PCB parameters: DB2/HP-150 Thickness: 5.5mm Surface treatment (such as test: 100% electronic test Packaging: vacuum packaging Delivery time: 10-15 days)

Number of PCB capacity
layers: 1-30
Quantity: 25,000 square meters/month
PCB type: 5oz immersed copper, impedance board, HDI, HF board, aluminum, FPC, soft-hard board PCB

basic material brand
HF: Rogers, Taconic
HTG: S1000 - 2M, Lianmao IT180A
solder mask: Taiyo PSR-2000/4000 series
surface treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” hard gold plating mixed
surface treatment: Im Au+OSP, Im Au+gold Finger, Im Ag+Gold Finger

PCB Technical Parameters
Minimum trace width/size: outer 2.5/2.5mil, inner 3/3mil (1/3, 1/2oz)
minimum via: 0.15mm/0.1mm (laser)
minimum Ring Ring: 4mil
Maximum Copper Thickness: 7oz
Maximum Size: 650x1100mm
Thickness Aperture Ratio: 20:1

Tolerance

PTH only: +/-0.0075mm (Simple: +/-0.05mm)

: +/-0.1mm (Simple: +/-0.05-0.075mm.