Low thermal impedance conductive silicon gap filler

Therm-Gap 1100SP05 is a single-sided composite material with good thermal conductivity. Low interfacial thermal resistance can be achieved at relatively low pressures. It is applied to the power device and the heat dissipation aluminum sheet or machine shell, which can effectively remove the air and achieve a good filling effect. Therm-Gap 1100SP05 has good insulation withstand voltage characteristics and thermal stability, making it safe and reliable to use.