MOQ | 1000 pieces |
Port | Shenzhen |
Packaging | 1000pcs per inner box;10000pcs per master carton. |
Lead Time | 2-3 weeks |
The 932 series provides protection for printed circuit boards used in a large variety of applications that need fuses with time-delay, low breaking capacity. The sub-miniature device is constructed of a plastic cap and base with a tin plated copper lead wire. It offers excellent mounting characteristics and is 100% tested for cold resistance.
Main Characteristics: Square sub-miniature fuse; Time-Lag (T)
Standard :IEC 60127-3/IV
Materials: Fuse body: Thermoplastic
Lead: Tin plated coppe
Operating Temperature: -55℃ to +125℃
Storage Conditions :+10℃ to +60℃
Relative humidity:≤75% yearly average
without dew, maximum 30 days at 95%
Vibration Resistance: 24 cycles at 15 min. each (60068-6)
10-60Hz at 0.75mm amplitude
60-2000Hz at 10g acceleration
Soldering Parameters :260℃.≤5 sec (Wave Soldering)
350℃.≤3 sec (Hand Soldering)
Soldering Peak: 260℃. 10 sec. (IEC 60068-20)
Rm.6F/Bl.16,No.1 HQ Valley,Xinzhu Rd.,Songshan Lake High-Tech Dev.Zone,Dongguan City,523808 P.R.C.