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Factory custom - made semiconductor packaging materials stamping lead frame

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Material CapabilitiesCopper Micro Machining or NotMicro Machining
Place of OriginChina Product NameHTSSOP20L(118X165)-8R
TypeSOP,SOT,LQFP,SSDIP,DIP,SSOP,TSSOP,SKDIP,SDIP,QSOP,etc MaterialA194/C19210/C194/C7025/C2680
FunctionSemiconductor package SizeCustomized OEM
Thickness (MM)Customized Processprogressive Stamping
Max Lead64 PIN Max Width100mm
Surface FinishPlating Sliver / Bare Copper/Roughing

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Zhuhai Fillgold Technology Co., Ltd. offers premium quality Factory Custom - Made Semiconductor Packaging Materials Stamping Lead Frame for B2B importers and distributors worldwide. Zhuhai Fillgold Technology Co., Ltd. is located in China and deals exclusively in the production and export of Injector Nozzle. Factory Custom - Made Semiconductor Packaging Materials Stamping Lead Frame is built with A194/C19210/C194/C7025/C2680.

Factory custom - made semiconductor packaging materials stamping lead frame Price in China

The price of Factory Custom - Made Semiconductor Packaging Materials Stamping Lead Frame from China is based on the bulk order quantity. Zhuhai Fillgold Technology Co., Ltd. offers flexible prices for Injector Nozzle variations depending on the importing country and quantity.

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