This is greg from Semicon Device Co. Ltd in South Korea
We need Quotation for Wafer having under specification.
1. Diameter : 6", Flat zone (55~57mm : JEDEC)
2. Growing Method : FZ
3. Doping Method : NTD
4. Thickness : 1050 +- 50um
5. Resistivity : 410 +- 30Ohm-cm
6. Polishing : DSP(Double Side Polishing) or SSP
7. Orientation : or
8. Quantity : 25 or 50
9. Requirement Delivery : 3 Months.
and Our Customer want to Development Devices and
May be If They will Optimize Specification and then
we will send to you 2nd. order.
Thank you
from
Rhee Tae pok
82-10-4760-7679
President of Semicon Device Co., Ltd.
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