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| Place of Origin | Henan, China | Brand Name | Hejin |
| Model Number | plate | Application | Electrical conduction, Decoration |
| Weight | As request | Dimensions | Thickness: 0.2-15mm |
| Grade | Copper and aluminum | Alloy Or Not | Non-Alloy |
| Powder Or Not | Not Powder | Cu Content (%) | 15-20 |
| Technique | Solid-Liquid machining processing | Material | Copper T2, Aluminum 1060 |
| Specification(thickness * width) | 0.1mm-15mm*30mm-1000mm | Copper and Aluminum weight ratio | Cu:AL: 32%-40%: 60%-68% |
| Copper and Aluminum volume ratio | Cu:AL: 15-20: 80-85 | Density(g/cm3) | 3.5-3.9 |
| Resistivity(u03a9mm2/m) | <0.019 | Tensile Strength(N/mm2) | More than 120 |
| Elongation(%) | 27-38 | Peeling Strength(N/mm) | more than 12 |
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