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High Thermally Conductive Gap Filler T-top81

Portexwork
Packagingbulk
Lead Time2 weeks

Product Details

LiPOLY T-top81

LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81 offers excellent performance at an extremely competitive price.

Features

Thermal conductivity: 8.0 W/m*K

Highly conformable

Ultra-soft

High thermal conductivity

High deflection material

Non-flammable interface material.

It is excellent for filling small air gaps, making reliable contact with heat source & sink

Applications

Between CPU and heat sink.

Between a component and heat sink.

Flat-panel displays

Power supplies

High-speed mass storage drives

Telecommunication hardware

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