MOQ | 500 pcs |
Port | china |
Packaging | General packing for thermal conductive silicon pad |
Lead Time | 10-15 days |
Price | $0.05 | Minimum Order | 500 |
Port | china | Lead Time | 10-15 days |
* ✔Good Heat Dissipation:Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, improve the heat transfer between the CPU / chipset / motherboard / module and the heat sink, and also serve as insulation, shock absorption and sealing Equal effect.