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Shenzhen, Guangdong, China
thermal management materials, thermal gap pad, thermal gap filler, thermally conductive adhesive
2008
11 - 50 People
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| Business Type | - |
| Company | Shenzhen Goldlink Tongda Electronics Co., Ltd. |
| Main Products | thermal management materials, thermal gap pad, thermal gap filler, thermally conductive adhesive, thermal gel |
| Established Year | 2008 |
| City / State | Shenzhen, Guangdong |
| Country | China |
| Address | |
| Total Employees | 11 - 50 People |
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