Base Material : FR-4, Hi-TG FR4, CEM-1, CEM-3
Copper Thickness : 0.3 oz-6 oz
Board Thickness : 0.4-3.0mm
Min. Hole Size : 0.1mm
Min. Line Width : 0.15mm
Min Line Spacing : 0.15mm
Surface Finishing : HSAL, ENIG, OSP
Layer No. : 1-24 Layers
PCB Test : Flying probe and AOI (Default)/Fixture Test
Base, Cover film, Stiffeners thickness : : 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil, 0.10um
BGA Ball Pitch : 1mm ~ 3mm (4mil ~ 12mil)
PCB Assembly Method : SMT, Through-hole, Mixed, BGA
PCB Assembly Test : Visual Inspection (default), AOI, FCT, X-RAY
Hi-TG FR4 Material : Tg-130 Tg-140 Tg-160 Tg-170
Electrical Testing : Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard : IPC-A-600H Class 2, Class 3, TS16949, UL, ROHS and as your need
Special requirements : Buried and blind vias, Impedance control, via plug, BGA soldering etc.
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