Base Material : FR-4,tef,aluminum base
Copper Thickness : 0.5oz-6oz
Board Thickness : 0.1 to 6.0mm(4 to 240mil)
Min. Hole Size : 0.1mm(4mil)
Min. Line Width : 4mil
Min. Line Spacing : 4mil
Surface Finishing : HASL,TIN,OSP,ENIG
Component Precision : up to 01005,0201,0402
Certification : ISO 9001 : 2008 / ISO 14001 : 2004 / UL Approval / TS16949
SMT Efficiency : QFP,TQFP,BGA,QFN,PLCC,SOT,SOIC
Testing Service : Omron AOI/X-Ray/ICT/Solder Paste Testing/Function Testing
Surface Finishing : HASL,Leadfree HASL,Immersion gold
Soldermask Color : Green/Blue/Red/Black/White...
Number of Layers : 1-30layers
Shipping : Sea/Air shipment/Express Courier
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